|Feeding Way:||Carry in or out track or on-line type or jig, single or double station||Laser Parameter:||Power Optional 50-200w|
|Solder Ball Size:||Ø0.25MM||Controlling Way:||PLC Action and PC Picture Processing|
|Repeated Precision:||±0.003mm||Vision Positioning System:||CCD 5Million pixels|
|Shape Size:||1250*950*1650mm||Load Plate Size:||<110*130mm|
|Power Supply:||Single Phase AC220V,15A||Wave Length:||1070±5mm|
|Name:||Power Optional Tin-Ball Spraying Soldering Pattern Constant or Pulse|
Power Optional 50-200w Laser Tin-Ball Spraying Soldering Machine,CWLS-01
Laser tin-ball soldering ball is laser through fiber transmission, the output port is attached to the top of tin-ball, to provide the inlet for high-pressure gas entrance in the annular cavity, to molten solder ball, then high pressure inert gas can ensure there is enough pressure to molten solder ball dripping, guarantee the tin ball will not be oxidation, high precision, good welding effect.
Multi-axis intelligent working platform, equipped with coaxial CCD positioning and monitoring system, effectively ensures soldering accuracy and yield rate.
Product Parameter :
Carry in or out track or on-line type or jig, single or double station
|Laser Parameter||Power Optional 50-200w|
|Wave Length : 1070±5mm|
|Pattern: Constant or Pulse|
|Solder Ball Size||Ø0.25MM|
|Controlling Way||PLC Action and PC Picture Processing|
|Vision Positioning System||CCD 5Million pixels|
|Resolution Rate :±5um|
|Load Plate Size||<110*130mm|
|Main Engine Weight||550KG|
|Power Supply||Single Phase AC220V,15A|
1.apply to solder with high-precision for -10um or +10um, the smallest interval of the product is 100um
2.Optional to a bigger range of the solder ball, the diameter is 0.25mm
3.apply to the metal surface with tin, gold and silver. More than 99% soldered product is good.
1.quickly done the process of heating and melting within 0.2s
2.melting the solder ball in the soldering place without splash
3.No flux is required, no pollution, long life time of electronics
4.The smallest diameter of the solder ball is 0.1mm, the machine meets the developing trend of integration and precision.
5. According to different size of the solder ball, the operator can solder different soldering points.
6.The quality of the soldered product is good
7. meet the need of massive production in assembly line with the cooperation of CCD positioning system
Microelectronics : aviation, military electronics industry, sensor industry
Other Industries : optical electronic industry, MEMS, sensor industry, BGA, HDD
OIS base -FPC reed soldering
|OIS Suspension Loop Welding|
VCM Module(Angle Soldering)
|HDD:the Width of Welding disc is 0.08mm and the Min distance is 0.1mm|
Future advances and developments of laser soldering
The most important characteristic of laser soldering is its non-contact soldering ability, and there is no contact at all with either the PCB or the component. There is no physical load placed on the PCB, only laser light and the solder supply. Laser’s great advantages are in its ability to efficiently apply pinpoint heat, to apply light to confined spaces where a tip cannot fit, and to handle tightly-spaced assemblies, by changing the light angle and taking other steps. Maintenance work can also be reduced.